Fiche vulnérabilité
CVE-2023-21671 : faille élevée qualcomm fastconnect 6700 firmware (CVSS 7.8)
Description
Memory Corruption in Core during syscall for Sectools Fuse comparison feature.
En bref
- Sévérité
- Élevée (CVSS 7.8)
- Vecteur CVSS
- CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
- Exploitation active
- Non signalée par la CISA
- Publication
- 7 nov. 2023
- Dernière mise à jour
- 17 juin 2026
Produits concernés
- qualcomm fastconnect 6700 firmware
- qualcomm fastconnect 6900 firmware
- qualcomm qca6391 firmware
- qualcomm qcm6490 firmware
- qualcomm qcs6490 firmware
- qualcomm qsm8350 firmware
- qualcomm video collaboration vc3 platform firmware
- qualcomm sd888 firmware
- qualcomm sm7315 firmware
- qualcomm sm7325p firmware
- qualcomm snapdragon 778g 5g mobile platform firmware
- qualcomm snapdragon 778g\+ 5g mobile platform firmware
- qualcomm snapdragon 780g 5g mobile platform firmware
- qualcomm snapdragon 782g mobile platform firmware
- qualcomm snapdragon 7c\+ gen 3 compute firmware
- qualcomm snapdragon 888 5g mobile platform firmware
- qualcomm snapdragon 888\+ 5g mobile platform firmware
- qualcomm wcd9370 firmware
- qualcomm wcd9375 firmware
- qualcomm wcd9380 firmware